JPH0731542Y2 - ボンディングツール - Google Patents

ボンディングツール

Info

Publication number
JPH0731542Y2
JPH0731542Y2 JP1989095299U JP9529989U JPH0731542Y2 JP H0731542 Y2 JPH0731542 Y2 JP H0731542Y2 JP 1989095299 U JP1989095299 U JP 1989095299U JP 9529989 U JP9529989 U JP 9529989U JP H0731542 Y2 JPH0731542 Y2 JP H0731542Y2
Authority
JP
Japan
Prior art keywords
bonding
tool
tip
lead bonding
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989095299U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334239U (en]
Inventor
勉 横堀
治文 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1989095299U priority Critical patent/JPH0731542Y2/ja
Publication of JPH0334239U publication Critical patent/JPH0334239U/ja
Application granted granted Critical
Publication of JPH0731542Y2 publication Critical patent/JPH0731542Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1989095299U 1989-08-15 1989-08-15 ボンディングツール Expired - Lifetime JPH0731542Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989095299U JPH0731542Y2 (ja) 1989-08-15 1989-08-15 ボンディングツール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989095299U JPH0731542Y2 (ja) 1989-08-15 1989-08-15 ボンディングツール

Publications (2)

Publication Number Publication Date
JPH0334239U JPH0334239U (en]) 1991-04-04
JPH0731542Y2 true JPH0731542Y2 (ja) 1995-07-19

Family

ID=31644569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989095299U Expired - Lifetime JPH0731542Y2 (ja) 1989-08-15 1989-08-15 ボンディングツール

Country Status (1)

Country Link
JP (1) JPH0731542Y2 (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744203B2 (ja) * 1987-06-26 1995-05-15 松下電器産業株式会社 ボンデイングツ−ル

Also Published As

Publication number Publication date
JPH0334239U (en]) 1991-04-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term